2005 ASME Heat Transfer Summer Conference Co-located with the InterPACK '05 Conference (description)

"2005 Heat Transfer Summer Conference"

Category:Academics, Applied Research Methods, Biomedical Engineering, Bioscience, Biotechnology, Engineering, Future Trends, Medical, Medicine, Microbiology, Nanotechnology, Research, Science, Science / Engineering, Technology, Technology/Science
Address:Westin St. Francis Hotel San Francisco, California, United States of America
Event dates:7/17/2005 - 7/22/2005 (This event has already taken place)
Event web site:
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Setting the Standard in Engineering Excellence and in Knowledge, Community and Advocacy for the Benefit of Humanity.


Topics to be Covered:

  • Engineering leaders from academics, industry, and government.
  • Bioheat Transfer Computational Techniques for Micro/Nano Systems Heat Transfer in Microscale Energy Conversion Devices Multiscale, Multiphase & Heat Transfer Systems Micro and Nanoscale Heat Transport Transport Phenomena in Bio-Materials & Bio-Processing Heat Sink Modeling and Characterization Heat Pipe/Thermosyphons for Electronic Cooling Micro/Nano-scale Thermal Phenomena in Electronic Equipment Data Center Thermal Management Thermal Challenges in Electronic and Optical Packaging in Data/Voice Equipment Liquid Cooling of Electronic Systems
Organizer phone:212/591.7159
Offering type:Conference
Specialty:Science / Engineering
Event frequency:Every Year
First Meeting:
Total events:10 years worth.
Est. attendance: 700
Target audience:Engineers
Other target audiences:
Host Sponsor:ASME
Est. # of exhibitors:15
Currency:US Dollars
CE Credits:


The ASME Heat Transfer Conference and the ASME InterPACK Conference are the flagship conferences of the Heat Transfer Division (HTD) and the Electronic and Photonic Packaging (EPPD) Division respectively. As such, the two conferences have served for many years as the premier venues for enabling hundreds of engineers to meet, exchange ideas and technical information, and to learn of the latest advances in technology in Heat Transfer and Electronic and Photonic Packaging technical disciplines and industries.


Registration Fee Details:

Please see the conference website at

Other items that tuition includes:

Attendance to all conference events as well as a copy of the published and presented papers.

Travel and hotel arrangements:

Please see the conference website at 
Contact Person:Kevin T. O'Connor
TitleManager, Engineering Programs
Organizer Address 13 Park Avenue
Organizer Address 2M/S 22W3
Organizer CityNew York
Organizer State: (US)New York
Organizer State/Province: (Outside US)
Organizer Zip or Postal Code10016
Organizer CountryUnited States of America
Organizer Phone212/591.7159
Organizer Fax212/591.7671
Structural makeupNon-Profit
Host Sponsor; Other SponsorsASME
Event Site/VenueSt. Francis Westin Hotel
Event sold out?No
Multiple locations or dates?Multiple locations on same date
Manufacturer and Organizational Sponsorships:To be announced.
Peripherally organized activities:See the website for updated details.
Statistics available for most recent event held in:2004
Average number in event attendance of:Academic/Faculty
Number in attendance of:Engineers
# of staff in attendance: 10
total attendance #: 700
Target BoundariesInternational
Refund Policy:Please see the conference website at
Is Registration contact information the same as Organizer Contact above?Yes
Web Page
Can one register for your CE on your web site?NA
Can registration be made by snail (regular) mail?Yes
Online housing reservations: 
Do you have additional written or AV materials for sale?Yes
If so, are they available for non-attendees as well as those attending?Yes
Is full tuition necessary to ensure registration?Yes
Will there be shuttle service available?NA
Abstract information:Please see the conference website at
Are there any particular aspects of your conference that you consider unique to your field?Please see the conference website at
Additional notes:Please see the conference website at

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